Heraeus Electronics

Live Session

Advanced Packaging Materials as Enablers for High-Density Power Electronics in AI Data Centers

The rapid deployment of AI workloads in data centers is driving new requirements for power electronics, including very high power density, fast load transients, and strict efficiency targets.

Live Session

Advanced Packaging Materials as Enablers for High-Density Power Electronics in AI Data Centers

Dr. Michael Jörger

Global Head of Technology

Dr. Michael Jörger has 20 year’s experience in managing product development and launching of innovative materials for electronics and renewable energies with a focus of Power Modules and Semiconductor Packaging materials. Michael holds a Ph.D. in Material Science from ETH Zurich, Switzerland, and a diploma in chemistry from the University of Karlsruhe in Germany. Currently he is Global Head of Technology at Heraeus Electronics GmbH & Co. KG.

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Heraeus Electronics

Advanced Packaging Materials as Enablers for High-Density Power Electronics in AI Data Centers

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