Advanced Packaging Materials as Enablers for High-Density Power Electronics in AI Data Centers

The rapid deployment of AI workloads in data centers is driving new requirements for power electronics, including very high power density, fast load transients, and strict efficiency targets. Although wide-bandgap semiconductors enable higher switching frequencies and lower losses, system performance is increasingly limited by packaging materials and thermal management. This paper reviews advanced packaging concepts for power modules and converters in AI data centers, with a focus on interconnect materials. The effects of sintered die-attach materials on electrical performance, thermal resistance, and reliability are analyzed, along with cost-efficient alternatives to precious-metal-based materials. The results show that optimized packaging material selection significantly improves performance while ensuring long-term reliability, underlining the importance of packaging co-design for future energy-efficient AI data centers.