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CoolSiC™ JFET and Its Benefits in Solid-State Power Distribution
Learn how Infineon devices enable safer, efficient protection by combining ultra-low RDS(on), bidirectional operation, and Q DPAK packaging to reduce losses, enhance reliability, and scale current.
This session explores how Infineon’s CoolSiC™ JFETs enable safer, more efficient solid-state power distribution and protection by combining ultra-low RDS(on), robust turn-off and avalanche capability, bidirectional operation, and top-side-cooled Q DPAK packaging.XT thermal interconnection. By the end of the session, participants will understand the basics of JFETs, key performance elements, and how to integrate CoolSiC™ JFETs in solid-state protection to reduce losses, enhance reliability, and scale current with easy paralleling.
Key Takeaways:
Introduction to the CoolSiC™ JFET family and its variants
Fundamentals of normally-on JFETs for protection circuits
JFET vs MOSFET principles: conduction losses, robustness, and thermal behavior
Packaging and thermal considerations: Q-DPAK top-side cooled and .XT for higher power density and reliability
Real-world examples of CoolSiC™ JFETs in action
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About
With over 10 years of experience in the semiconductor industry, Rene Mente has worked extensively on SiC devices as a product definition engineer. He currently serves as an expert in the development of Infineon CoolSiC™ JFETs and their use in industrial applications such as solid-state circuit breakers.
About
Drawing on extensive power distribution and protection experience, Elijah Fagbemi drives the strategic development and market positioning of 400–950 V Si and SiC devices for solid state power distribution, with a primary focus on CoolSiC™ JFET
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Aleksei Cherkasov
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